Lesotho Low-temperature Adhesive Film
Category:
Product Description
| Model | DZ-832G | DZ-830G | DZ-837G | DZ-838G | DZ-850K | DZ-825K | DZ-860K |
| Thickness | 0.05/0.075/0.10/0.125/0.15/0.175/0.20mm | ||||||
| Hardness | 70A | 75A | 75A | 70A | 70A | 68A | 68A |
| Material | TPU | TPU | TPU | TPU | TPU | TPU | TPU |
| Width | 1524mm | 1524mm | 1524mm | 1524mm | 1524mm | 1524mm | 1524mm |
| Washing Condition | Maximum 40℃ | ||||||
| Melting Point | 90±5℃ | 105±5℃ | 100±5℃ | 85±5℃ | 80±5℃ | 80±5℃ | 80±5℃ |
Recommended Parameters for Usage
| Model | DZ-832G | DZ-830G | DZ-837G | DZ-838G | DZ-850K | DZ-825K | DZ-860K |
| Reference Operating Temperature | 125℃-145℃ | 135℃-155℃ | 130℃-150℃ | 120℃-140℃ | 120℃-135℃ | 115℃-135℃ | 115℃-135℃ |
| Reference Operating Time | 20-30s | 20-30s | 20-30s | 20-30s | 20-30s | 20-30s | 20-30s |
| Reference Operating Pressure | 3-5kgf/m2 | 3-5kgf/m2 | 3-5kgf/m2 | 3-5kgf/m2 | 3-5kgf/m2 | 3-5kgf/m2 | 3-5kgf/m2 |

In many areas of industrial production and daily life, bonding materials is crucial. Low-temperature hot melt adhesive film, with its unique advantages, has become a highly sought-after bonding solution.
Low-temperature hot melt adhesive film is a film product that melts and bonds at relatively low temperatures. Made primarily of thermoplastic polymers, it typically appears as a uniform, smooth film.
One of its notable features is its low-temperature adaptability. Compared to traditional hot melt adhesives, it requires lower heating temperatures, typically melting at 80-120°C. This significantly reduces energy consumption and prevents damage to heat-sensitive materials. This is particularly advantageous in bonding electronic components, plastics, and textiles. For example, in electronics production, using low-temperature hot melt adhesive film prevents high temperatures from damaging delicate electronic components, ensuring product stability and reliability.
It is extremely easy to use. Simply place the film between the materials to be bonded. Using a heating device to apply the appropriate temperature and pressure, the film quickly melts and penetrates the surfaces. Upon cooling, a strong bond is formed. This method not only saves time but also improves production efficiency, making it suitable for large-scale automated production.
Low-temperature hot melt adhesive film offers high bond strength and excellent weather resistance. It maintains stable bonding performance under diverse environmental conditions, resisting the effects of humidity, high temperatures, and low temperatures, ensuring long-term bond strength. Furthermore, its excellent flexibility and elasticity adapt to material deformation and expansion, preventing cracking or peeling.
Low-temperature hot melt adhesive film is environmentally friendly and pollution-free, meeting the requirements of modern industry for green production. It demonstrates excellent bonding performance in a wide range of industries, including packaging, footwear, and automotive interiors, providing strong support for their development. Whether you're a manufacturer seeking efficient production or an environmentally conscious consumer, low-temperature hot melt adhesive film is a reliable lamination option.